JPH0325415Y2 - - Google Patents
Info
- Publication number
- JPH0325415Y2 JPH0325415Y2 JP12229885U JP12229885U JPH0325415Y2 JP H0325415 Y2 JPH0325415 Y2 JP H0325415Y2 JP 12229885 U JP12229885 U JP 12229885U JP 12229885 U JP12229885 U JP 12229885U JP H0325415 Y2 JPH0325415 Y2 JP H0325415Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- soldering
- legs
- fixing piece
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12229885U JPH0325415Y2 (en]) | 1985-08-08 | 1985-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12229885U JPH0325415Y2 (en]) | 1985-08-08 | 1985-08-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6230352U JPS6230352U (en]) | 1987-02-24 |
| JPH0325415Y2 true JPH0325415Y2 (en]) | 1991-06-03 |
Family
ID=31012354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12229885U Expired JPH0325415Y2 (en]) | 1985-08-08 | 1985-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325415Y2 (en]) |
-
1985
- 1985-08-08 JP JP12229885U patent/JPH0325415Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230352U (en]) | 1987-02-24 |
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